StarTech.com High-Performance Silicone Thermal Paste, 14.5W/m•K Conductivity, Grease Compound for CPUs, GPUs, and ICs, Improves Heat Dissipation in Computers. Type: Thermal paste, Thermal conductivity: 14.5 W/m·K, Constitutive ingredients: Aluminium oxide, Silicone, Zinc oxide. Width: 26.6 mm, Depth: 126 mm, Height: 17.2 mm. Quantity per pack: 1 pc(s), Package width: 160 mm, Package depth: 60 mm. Master (outer) case width: 500 mm, Master (outer) case length: 330 mm, Master (outer) case height: 255 mm
